Express-SL/SLE (Basic Size Modules 125 mm x 95 mm)
- 6th Gen Intel Core, Intel Xeon and Celeron Processor
- Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz
- (supports both ECC and non-ECC memory)
- 3x DDI channels, 1x LVDS (or 4 lanes eDP) supports up to 3 independent displays
- 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)
- GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
- Extreme Rugged operating temperature: -40°C to +85°C (build option)
Express-KL/KLE (Basic Size Modules 125 mm x 95 mm)
- 7th Gen Intel Core, Intel Xeon Processor
- Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz
- (supports both ECC and non-ECC memory)
- 3x DDI channels, 1x LVDS (or 4 lanes eDP) supports up to 3 independent displays
- 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)
- GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
- Extreme Rugged operating temperature: -40°C to +85°C (build option)
Express-CF/CFE (Basic Size Modules 125 mm x 95 mm)
- PICMG COM.0 R3.0 Type 6 module with hexacore and quad-core Intel processors
- Up to 48GB Dual Channel DDR4 at 2133/2400MHz
- Three DDI channels, one LVDS (or 4 lanes eDP), supports up to 3 independent displays
- One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel Optane Memory Technology support)
- GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
Express-CFR (Basic Size Modules 125 mm x 95 mm)
- PICMG COM.0 R3.0 Type 6 module with 45W/25W hexacore and quad-core Intelprocessors
- Up to 96GB* Dual Channel DDR4 at 2133/2400 MHz in up to three SO-DIMM sockets (*under validation)
- Three DDI channels, one LVDS, supports up to 3 independent displays (VGA, eDP by build option)
- One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel Optane Memory Technology support)
- GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
- Extreme Rugged operating temperature: -40°C to +85°C
- (build option, selected SKUs)
cExpress-AL (Compact Size Module 95 mm x 95 mm)
- Intel Atom E3900 series (formerly codename: Apollo Lake) and Pentium /Celeron SOC, supporting full virtualization (VT-d/VT-x)
- Supports IEEE 1588 Precision Time Protocol (PTP)
- Up to 8GB dual channel non-ECC DDR3L at 1867/1600 MHz
- Two DDI channels, one LVDS (VGA/eDP by build option), supports up to 3 independent displays
- Up to Five PCIe x1 Gen2 (by PCIe bridge IC, build option)
- Two SATA 6 Gb/s, three USB 3.0/2.0, five USB 2.0 and eMMC 5.0 (build option)
- Extreme Rugged operating temperature: -40°C to +85°C
- (build option for E39XX SKUs)
cExpress-SL (Compact Size Module 95 mm x 95 mm)
- 6th Generation Intel Core and Celeron Processors
- Up to 32GB Dual Channel non-ECC DDR4 at 1867/2133MHz
- Two DDI channels, one LVDS (build option 4 lanes eDP), supports up to 3 independent displays
- GbE, up to 6 PCIe x1 (build option)
- Up to three SATA 6 Gb/s, four USB 3.0 and four USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
- Extreme Rugged operating temperature: -40°C to +85°C
- (build option)
cExpress-KL (Compact Size Module 95 mm x 95 mm)
- 7th Generation Intel® Core™ and Celeron® Processors
- Up to 32GB Dual Channel DDR4 at 1867/2133MHz
- Supports up to 3 independent displays in combinations of DDI, LVDS, VGA, eDP
- GbE, up to 6 PCIe x1 (build option)
- Three SATA 6 Gb/s, four USB 3.0 and four USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
- Extreme Rugged operating temperature: -40°C to +85°C
- (build option)
cExpress-WL (Compact Size Module 95 mm x 95 mm)
- 8th Gen quad/dual-core Intel Core Processors
- Up to 64GB Dual Channel non-ECC DDR4 at 2133/2400MHz
- Two DDI channels, one LVDS (opt. 4 lanes eDP), one opt. VGA, supports up to 3 independent displays
- Up to eight PCIe lanes, GbE
- Up to three SATA 6 Gb/s, four USB 3.1 Gen2 and four USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
- Extreme Rugged operating temperature: -40°C to +85°C
- (optional)
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