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COM Express Type 6 (Basic and Compact Size Modules)

Express-SL/SLE (Basic Size Modules 125 mm x 95 mm)

  • 6th Gen Intel Core, Intel Xeon and Celeron Processor
  •  Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz
  • (supports both ECC and non-ECC memory)
  • 3x DDI channels, 1x LVDS (or 4 lanes eDP) supports up to 3 independent displays
  • 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)
  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C (build option)

 

 

 

 

Express-KL/KLE (Basic Size Modules 125 mm x 95 mm)

  • 7th Gen Intel Core, Intel Xeon Processor
  • Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz
  • (supports both ECC and non-ECC memory)
  • 3x DDI channels, 1x LVDS (or 4 lanes eDP) supports up to 3 independent displays
  • 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)
  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C (build option)

 

 

 

Express-CF/CFE (Basic Size Modules 125 mm x 95 mm)

  • PICMG COM.0 R3.0 Type 6 module with hexacore and quad-core Intel processors
  • Up to 48GB Dual Channel DDR4 at 2133/2400MHz
  • Three DDI channels, one LVDS (or 4 lanes eDP), supports up to 3 independent displays
  • One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel Optane Memory Technology support)
  • GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions

 

 

 

 

 

Express-CFR (Basic Size Modules 125 mm x 95 mm)

  • PICMG COM.0 R3.0 Type 6 module with 45W/25W hexacore and quad-core Intelprocessors
  • Up to 96GB* Dual Channel DDR4 at 2133/2400 MHz in up to three SO-DIMM sockets (*under validation)
  • Three DDI channels, one LVDS, supports up to 3 independent displays (VGA, eDP by build option)
  • One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel Optane Memory Technology support)
  • GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C
  • (build option, selected SKUs)

 

 

 

cExpress-AL (Compact Size Module 95 mm x 95 mm)

  • Intel Atom E3900 series (formerly codename: Apollo Lake) and Pentium /Celeron SOC, supporting full virtualization (VT-d/VT-x)
  • Supports IEEE 1588 Precision Time Protocol (PTP)
  • Up to 8GB dual channel non-ECC DDR3L at 1867/1600 MHz
  • Two DDI channels, one LVDS (VGA/eDP by build option), supports up to 3 independent displays
  • Up to Five PCIe x1 Gen2 (by PCIe bridge IC, build option)
  • Two SATA 6 Gb/s, three USB 3.0/2.0, five USB 2.0 and eMMC 5.0 (build option)
  • Extreme Rugged operating temperature: -40°C to +85°C
  • (build option for E39XX SKUs)

 

cExpress-SL (Compact Size Module 95 mm x 95 mm)

  • 6th Generation Intel Core and Celeron Processors
  • Up to 32GB Dual Channel non-ECC DDR4 at 1867/2133MHz
  • Two DDI channels, one LVDS (build option 4 lanes eDP), supports up to 3 independent displays
  • GbE, up to 6 PCIe x1 (build option)
  • Up to three SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C
  • (build option)

 

 

 

 

cExpress-KL (Compact Size Module 95 mm x 95 mm)

  • 7th Generation Intel® Core™ and Celeron® Processors
  • Up to 32GB Dual Channel DDR4 at 1867/2133MHz
  • Supports up to 3 independent displays in combinations of DDI, LVDS, VGA, eDP
  • GbE, up to 6 PCIe x1 (build option)
  • Three SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C
  • (build option)

 

cExpress-WL (Compact Size Module 95 mm x 95 mm)

  • 8th Gen quad/dual-core Intel Core Processors
  • Up to 64GB Dual Channel non-ECC DDR4 at 2133/2400MHz
  • Two DDI channels, one LVDS (opt. 4 lanes eDP), one opt. VGA, supports up to 3 independent displays
  • Up to eight PCIe lanes, GbE
  • Up to three SATA 6 Gb/s, four USB 3.1 Gen2 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C
  • (optional)

 

Фотогалерея



Файлы


cExpress-KL_Datasheet_en_20170807_v1.pdf (313.14 Kb)
cExpress-AL-新版型-20190419.pdf (605.17 Kb)
cExpress-SL-Datasheet_20170301.pdf (306.19 Kb)
cExpress-WL-20190624.pdf (614.59 Kb)
Express-CF-CFE-20190528.pdf (508.38 Kb)
Express-CFR-20190521.pdf (510.58 Kb)
Express-KL-KLE-20180607.pdf (271.16 Kb)
Express-SL-SLE-NEW-20190304.pdf (544.91 Kb)
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